Manufacturing, Mechanical, and Electrical Engineering Design Services
Expert Manufacturing, Mechanical, and Electrical Engineering Design Services. Unleash Innovation and Precision in Every Detail. Elevate Your Project with our Collaborative Expertise.
Hardware Installation Service
- Assemble and proceed to test for product installation
- Provide global installation service
- Manage the output schedule
- Escalate key issues to stakeholders
- First-line troubleshooting skill
- Drive product quality and continuous improvement
High Volume Production Manpower
- We provide talents with different semiconductor equipment vendors’ experience in system installation/customer service/module assembly, etc., and also with domain know-how.
- Can be trained easily and provide more troubleshooting service in a short time.
- High quality/Low cost for saving company costs regarding hiring, training, and time.
- Employee manning review, movement, and succession planning for different module assemblies support will be easier
Field SITE Customer Service Manpower
- Provide manpower with experience in Customer Service/ Field Application/ Prevention Maintenance /Corrective Maintenance
- Help customers to improve the wafer fabrication process
- Monitoring production status and providing feedback to customers regarding issues’ root causes, containment, and improvement actions.
Electrical Engineering Design
- DW creation
- SMPS: AC- DC, DC- DC
- Schematics & PCB Layout
- Obsolescence Management
- Field failure analysis
- Module Conversion
- Design of ultra low noise including power supply
- Analysis, Simulation & improvement of existing circuits
- DFM/DFT implementation
- Proto build
Electrical Capability
Discreate Services
Mechanical Design
- Concept Generation
- EME- Design & Development- Cabinet
- Cable & Bundle Routing
- Detail Engineering
- Engineering Analysis/ Simulation
- Mechanical Testing Solutions
- Pre-Installation docs/ TPD preparations
- Document Preparation
- BoM Management
- Production issues/Support
- Proto build
Mechanical Engineering Capability
Discreate Services
Contamination Control & Cleanroom Cleaning Service
- Cleanroom cleaning
- Cleanroom validation measurement
- Airborne particle counter measurement
- Surface particle counter measurement
- Surfscan Sp1 measurement
- PDM measurement
- Manufacturing defect analysis
- Cleanroom contamination Risk Control
Surface Particle Counter Measurement
Particle Guard
- Exposure of clean (8-inch) wafers (to process/ activities/ environment).
- Measure the number and size of added particles on the wafer
- Measurement tool: Particle Guard (Surface particle counter/ ACP) – Light scattering
- Measurement surface 25 – 30 cm2 (100 measurement spots/ wafer)
- Measurement data converted into the number of: added particles/ dm2 or added particles/ dm2/ hour
– Spot size: 24 mm2
– Detection range: 0,5 µm – 6 mm
- Manual scanning of witness plate (risk of adding particles, time)
- Contact measurement (risk of adding/ removing/ replacing particles)
- Moderate accuracy for particle sizes 0,5 – 50 µm
PartSens
- numbers & sizes (≥ 3µm)
- Measurement spot: 32 mm2 (6.53 x 4.90 mm2)
- Non metallic particles 2µm – >3000µm
- Metallic Particles 25µm – >3000µm
- Fiber 50µm – >3000µm
- Measurement tool: PartSens (Surface particle counter/ Intechno)
- Black sticky PU elastomer: Ø 30 mm
- Sample area PMC: 2 cm2 (Ø 17 mm = 2.27cm2)
- Pick-up efficiency: 93% +/- 5% (for particle sizes ≥ 2µm)
- Effective for particle size ≥ 0.5 µm
PDM Measurement
More accurate large particle detection with less diffraction impact:
- Exposure of clean glass plates (49cm2) to process/ activities
- Measure nr and size of added particles on wafer, after exposure
- Type: PDM
- Manufacturer: SAC
- Measurement area: 49 cm2
- Detection range: 10µm -12000µm
Manufacturing Defect Analysis
Materials analysis
- TEM, STEM (EDS & EELS):
– TEM analysis for EUV PR & low-k
– Algorithm for CD measurements
– Self-development ALD
- FIB & PFIB
- Less curtain effect for FIB/PFIB
- SEM
- Energy-filter SEM imaging
Surface analysis
- New SIMS chamber, low elemental
detection limit - Angle-resolved XPS for super-thin film analysis
- Biggest AFM sample holder, 12” wafer-size
- Special method to reduce water influence during FTIR analysis & fully-equipped database for comparison
Failure analysis
- The best spatial resolution of 3D X-ray & TDR
- The highest sensitivity of LIT & HT-InGaAs
- Nanoprobe for < 5 nm node EBIC, EBAC, and EBIRCH for advanced node
- High-quality parallel lapping
Cleanroom Contamination Risk control
Using HACCP(Hazard Analysis Control Critical Point) & FMEA(Failure Mode Evaluation Analysis) as flow evaluation mode:
Step 1: Identify the source and route of contamination
Step 2: Risk Assessment and Source Control
Step 3: Establish an effective monitoring program
Step 4: System Validation and Re-evaluation
Step 5: Documentation of the Monitoring System
Step 6: Education and Training for Personnel